From October 10th to 13th, the flagship conference of the IEEE Vehicular Technology Society, the "IEEE Vehicular Technology Conference (VTC) Fall," was held in Hong Kong, China. Associate Professor Sun Shu from the Department of Electronic Engineering at the School of Electronic Information and Electrical Engineering of Shanghai Jiao Tong University was honored with the 2023 IEEE Vehicular Technology Society Early Career Award and the 2023 Neal Shepherd Memorial Best Propagation Paper Award. Each of these prestigious awards is granted to only one recipient worldwide annually.
2023 IEEE VTS Early Career Award
Reasons for the award: For foundational contributions to the development of 5G millimeter-wave communication (one of the earliest scholars to conduct large-scale experiments on cellular millimeter-wave propagation and channel modeling).
2023 Neal Shepherd Memorial Best Propagation Paper Award
Award-winning paper: "Propagation Models and Performance Evaluation for 5G Millimeter-Wave Bands"
Paper link: https://ieeexplore.ieee.org/document/8386686
Author Profile
Sun Shu, graduated with a bachelor's degree from Shanghai Jiao Tong University in 2012, completed a Ph.D. at New York University in 2018, and joined the School of Electronic Information and Electrical Engineering at Shanghai Jiao Tong University in 2021 as a tenured associate professor and doctoral supervisor in the Department of Electronic Engineering. Specializing in research areas such as millimeter-wave communication, integrated sensing, intelligent metamaterials, Sun Shu has accumulated over 20,000 citations on Google Scholar. Her research contributions in the field of millimeter-wave communication have been adopted by 3GPP standards and domestic and international white papers. She has received numerous awards, including the 2015 IEEE Donald Fink Award, the Best Paper Award at the 2016 IEEE Vehicular Technology Conference Spring Meeting, the 2017 IEEE Neal Shepherd Best Propagation Paper Award, the 2017 Marconi Society Young Scholar Award, the 2018 NYU Dante Y. Lee Award, and the 2021 Intel Corporation Outstanding Inventor Award.