Recently, the 5th “Huawei Cup” China Postgraduate IC Innovation Competition (CPICIC) was successfully held in Hangzhou, Zhejiang. SJTU students have won the grand prize “The Star of Innovation” and four first prizes, two second prizes and a third prize. They are students at the School of Electronic Information and Electrical Engineering (SEIEE): the Department of Micro-Nano Electronics and the Department of Electronic Engineering.

One hundred fifty-four teams from 48 universities in China participated in the final competition of the CPICIC, and nearly 500 students competed fiercely through examinations, oral defenses, and presentations. Finally, the winners for the three “Stars of Innovation”, 12 first prizes and 36 second prizes were selected. Nine teams from SEIEE of SJTU signed up for the competition, and eight teams successfully made it to the final and won awards. Moreover, the number of first prizes won by SJTU ranked first among all participating universities.

SEIEE of SJTU has participated in the competition for five consecutive years with excellent results. This year, SEIEE students once again won the highest award, “The Star of Innovation”. After 2019 and 2020, this is the third time that students of SEIEE have won this honor. The award-winning work is entitled “The Design of High Reliability and Low Power Consumption On-Chip Interconnection Circuit”. Aiming at the demand and challenges of maintaining high reliability, low latency, and low power consumption of on-chip interconnection in multi-core operating systems, this work reduces the metastable state risk in Clock Domain Crossing (CDC) by ten orders of magnitude. It also reduces the delay in data transmission through metastable state prediction and solution technology. Also, it effectively reduces the power consumption of interconnection by about 50% through the charge recovery technology based on coding. The design of the on-chip interconnection circuit proposed in this work is significant as it could meet the demand for high-efficiency and high-reliability interconnection of multi-core systems and promote the commercialization of related scientific achievements.